A new technology for stacking several layers of microprocesssors, which is being developed at IBM Research - Zurich, to be used in the CMOSAIC project with ETH Zurich and EPFL. IBM scientists believe the design can boost the performance of computer chips by a factor 10. The team estimates that the first 3D chips will be implemented in supercomputers by 2015 with a novel internal cooling system fully operational by 2020, for even further improvements.
A sugar cubes are used for size comparison.
Photo credit Michael Lowry
IMAGE and TEXT CREDIT: By IBM Research - Zurich © Copyright All Rights Reserved.