Sandia Laboratories has developed a new technology with potential to dramatically alter air-cooling landscape in computing and microelectronics

Sandia’s “Cooler” technology offers fundamental breakthrough in heat transfer for microelectronics, other cooling applications.

Licensing opportunities now available

LIVERMORE, Calif. — Sandia National Laboratories has developed a new technology with the potential to dramatically alter the air-cooling landscape in computing and microelectronics, and lab officials are now seeking licensees in the electronics chip cooling field to license and commercialize the device.

The “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger,” is a novel, proprietary air-cooling invention developed by Sandia researcher Jeff Koplow, who was recently selected by the National Academy of Engineering (NAE) to take part in the NAE’s 17th annual U.S. Frontiers of Engineering symposium.

Koplow said the Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments. The yearly electricity bill paid by the information technology sector in the U.S. is currently on the order of seven billion dollars and continues to grow.

Sandia’s Jeff Koplow makes an adjustment to an earlier prototype of his Air Bearing Heat Exchanger invention. The technology, as known as the “Sandia Cooler,” will significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments. (Photo by Dino Vournas)

Dramatic improvements in cooling, other benefits In a conventional CPU cooler, the heat transfer bottleneck is the boundary layer of “dead air” that clings to the cooling fins. With the Sandia Cooler, heat is efficiently transferred across a narrow air gap from a stationary base to a rotating structure. The normally stagnant boundary layer of air enveloping the cooling fins is subjected to a powerful centrifugal pumping effect, causing the boundary layer thickness to be reduced to ten times thinner than normal. This reduction enables a dramatic improvement in cooling performance within a much smaller package. Additionally, the high speed rotation of the heat exchanger fins minimizes the problem of heat exchanger fouling. The way the redesigned cooling fins slice through the air greatly improves aerodynamic efficiency, which translates to extremely quiet operation. The Sandia Cooler’s benefits have been verified by lab researchers on a proof-of-concept prototype approximately sized to cool computer CPUs. The technology, Koplow said, also shows great potential for personal computer applications. Broader energy sector applications The Sandia Cooler also offers benefits in other applications where thermal management and energy efficiency are important, particularly heating, ventilation and air-conditioning (HVAC). Koplow said that if Air Bearing Heat Exchanger technology proves amenable to size scaling, it has the potential to decrease overall electrical power consumption in the U.S. by more than seven percent.

Companies interested in licensing the Sandia Cooler are invited to review and respond to the solicitation through July 15. The solicitation can be found here. Although it is first focused on licensing opportunities in the field of electronics chip cooling, Sandia will soon establish a separate process for exploring partnering and/or licensing opportunities in other fields.

A technical white paper on the Sandia Cooler technology can be found here.

Sandia’s work on the cooler technology was funded initially through internal investments. Follow-on funding is also being provided by the Department of Energy’s Office of Energy Efficiency and Renewable Energy (EERE).

Sandia National Laboratories is a multiprogram laboratory operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration. With main facilities in Albuquerque, N.M., and Livermore, Calif., Sandia has major R&D responsibilities in national security, energy and environmental technologies, and economic competitiveness.

Sandia media relations contact: Mike Janes, mejanes@sandia.gov (925) 294-2447

The more widely and uniformly dispersed nanoscale plates of clay are in a polymer, the more fire protection the nanocomposite material provides

If materials scientists accompanied their research with theme songs, a team from the National Institute of Standards and Technology (NIST) and the University of Maryland (UMD) might be tempted to choose the garage punk song "Don't Crowd Me"* as the anthem for the promising, but still experimental nanocomposite fire retardants they are studying.

That's because the collaborators have demonstrated that the more widely and uniformly dispersed nanoscale plates of clay are in a polymer, the more fire protection the nanocomposite material provides.

Writing in the journal Polymer,** the team reports that in tests of five specimens—each with the same amount of the nanoscale filler (5 percent by weight)—the sample with the most widely dispersed clay plates was far more resistant to igniting and burning than the specimen in which the plates mostly clustered in crowds. In fact, when the two were exposed to the same amount of heat for the same length of time, the sample with the best clay dispersion degraded far more slowly. Additionally, its reduction in mass was about a third less.

In the NIST/UMD experiments, the material of interest was a polymer—a type of polystyrene, used in packaging, insulation, plastic cutlery and many other products—imbued with nanometer scale plates of montmorillonite, a type of clay with a sandwich-like molecular structure. The combination can create a material with unique properties or properties superior to those achievable by each component—clay or polymer—on its own.

Polymer-montmorillonite nanocomposites have attracted much research and commercial interest over the last decade or so. Studies have suggested that how the clay plates disperse, stack or clump in polymers dictates the properties of the resultant material. However, the evidence—especially when it comes to the flammability properties of the nanocomposites—has been somewhat muddy.

Led by NIST guest researcher Takashi Kashiwagi, the NIST-UMD team subjected their clay-dispersion-varying samples to an exhaustive battery of characterization methods and flammability tests. Affording views from the nanoscopic to the microscopic, the array of measurements and flammability tests yielded a complete picture of how the nanoscale clay plates dispersed in the polymer and how the resultant material responded when exposed to an influx of heat.

The researchers found that with better dispersion, clay plates entangle more easily when exposed to heat, thereby forming a network structure that is less likely to crack and leading to fewer gaps in the material. The result, they say, is a heat shield that slows the rate of degradation and reduces flammability. The NIST team, led by Rick Davis, is now exploring other approaches to reduce flammability, including the use of advanced materials and novel coating techniques.

* Keith Kessler, "Don't Crowd Me."
** M. Liu, X. Zhang, M. Zammarano, J.W. Gilman, R.D. Davis and T. Kashiwagi. Effect of Montmorillonite dispersion on flammability properties of poly(styrene-co-acrylonitrile) nanocomposites. Polymer. Vol. 52, Issue 14, June 22, 2011.

Contact: Mark Bello mark.bello@nist.gov 301-975-3776 National Institute of Standards and Technology (NIST)